1. 2. 3. material content data sheet sales product name btm7745g issued 29. august 2013 ma# MA000778420 package pg-dso-36-29 weight* 616.28 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 3.155 0.51 0.51 5120 5120 leadframe inorganic material phosphorus 7723-14-0 0.055 0.01 89 non noble metal zinc 7440-66-6 0.220 0.04 356 non noble metal iron 7439-89-6 4.391 0.71 7126 non noble metal copper 7440-50-8 178.313 28.93 29.69 289338 296909 wire noble metal gold 7440-57-5 0.469 0.08 760 non noble metal aluminium 7429-90-5 1.277 0.21 0.29 2071 2831 encapsulation organic material carbon black 1333-86-4 0.838 0.14 1360 plastics epoxy resin - 59.912 9.72 97216 inorganic material silicondioxide 60676-86-0 358.217 58.12 67.98 581257 679833 leadfinish non noble metal tin 7440-31-5 4.833 0.78 0.78 7843 7843 plating noble metal silver 7440-22-4 2.839 0.46 0.46 4607 4607 glue plastics epoxy resin - 0.308 0.05 500 noble metal silver 7440-22-4 1.452 0.24 0.29 2357 2857 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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